Architecture & design
Define the operations a processor should accelerate. Hardware architects and software teams work together: a useful chip needs a usable programming model.
- INPUT
- Workloads, algorithms, IP
- OUTPUT
- A verified chip design
A guided map from an architecture decision to a deployed service. Choose a stage, then meet the collaborators around it.
Define the operations a processor should accelerate. Hardware architects and software teams work together: a useful chip needs a usable programming model.
Repeated deposition, patterning and etching build electronic circuits on a wafer. The foundry turns a design into physical silicon.
Compute needs a steady stream of data. Stacked HBM places substantial memory bandwidth close to the accelerator package.
Chips and memory must be connected, protected and tested. Advanced packaging is an integration discipline, not simply a protective box.
Processors become systems through boards, power delivery, firmware, cooling and validation. Integrators make these parts work together.
A rack needs a wider environment: network fabrics exchange data, electrical systems supply energy and cooling removes heat.
Cloud providers and enterprise operators make computing available to users. Scheduling, isolation, storage and support matter alongside processors.
Libraries, runtimes and deployment tools connect hardware to useful work. Developers and researchers supply models, data and domain knowledge.
A sourced directory, not an exclusive bill of materials. Dates refer to announcements or reporting periods; plans are not completed facilities.
CPU architecture ecosystem for Grace.
Arm · Neoverse and Grace · 2022 ↗Blackwell foundry; Arizona production reported in April 2025.
NVIDIA · Manufacturing announcement · 2025-04-14 ↗HBM3E selected for H200, according to Micron.
Micron · HBM3E / H200 · 2024-02-26 ↗Named memory supplier in the annual report.
NVIDIA · FY2025 annual report / pp. 6–12, 78 ↗Named memory supplier; not a blanket HBM qualification claim.
NVIDIA · FY2025 annual report / pp. 6–12, 78 ↗Announced Arizona packaging and testing partner.
NVIDIA · Manufacturing announcement · 2025-04-14 ↗Announced Arizona packaging and testing partner.
NVIDIA · Manufacturing announcement · 2025-04-14 ↗Houston supercomputer manufacturing plan.
NVIDIA · Manufacturing announcement · 2025-04-14 ↗Dallas supercomputer manufacturing plan.
NVIDIA · Manufacturing announcement · 2025-04-14 ↗Blackwell system and enterprise-delivery collaboration.
NVIDIA · Blackwell announcement · 2024-03-18 ↗Equipment models in the AI-factory digital-twin blueprint.
NVIDIA · AI factory digital twins · 2025-05-18 ↗Power, cooling and mechanical digital-twin assets.
NVIDIA · AI factory digital twins · 2025-05-18 ↗Power-system simulation and facility assets.
NVIDIA · AI factory digital twins · 2025-05-18 ↗Thermal and infrastructure simulation integration.
NVIDIA · AI factory digital twins · 2025-05-18 ↗Blackwell adoption and Project Ceiba collaboration announced.
NVIDIA · Blackwell announcement · 2024-03-18 ↗Announced GB200 infrastructure adoption.
NVIDIA · Blackwell announcement · 2024-03-18 ↗Blackwell adoption announced for cloud and internal teams.
NVIDIA · Blackwell announcement · 2024-03-18 ↗Blackwell cloud collaboration announced.
NVIDIA · Blackwell announcement · 2024-03-18 ↗Industrial software integration with Omniverse.
NVIDIA · Omniverse ecosystem · 2025-03-18 ↗