FIELD NOTES / 03 · 1963—2025Know the layers.
See the system.
Twelve products and platforms, explained by purpose. Compare their roles rather than treating unlike products as a benchmark race.
BECOMING JENSENAN INDUSTRIAL ATLAS
NVLink
NETWORK / 2024–2025Spectrum-X
NETWORK / 2024–2025CUDA
SOFTWARE / 2006 onwardOmniverse
SOFTWARE / 2025 view SIDE BY SIDECompare the roles.
Choose up to three products above.
A SMALL FIELD DICTIONARYMake the language
less mysterious.
Fabless+
A company designs chips while using outside manufacturing partners. It still performs substantial hardware and software engineering.
HBM+
Stacked memory designed to move large amounts of data. Capacity measures how much fits; bandwidth measures how fast it moves.
Packaging+
The electrical and physical integration of dies, memory and connections. It is a critical engineering step after wafer fabrication.
Scale up / out+
Scale up tightly connects processors within a system or domain. Scale out connects more systems through a network.
Training / inference+
Training adjusts a model using data. Inference uses a trained model to produce outputs. Both consume compute, in different patterns.
Digital twin+
A digital representation connected to a physical asset or process, used for analysis and simulation. It requires maintained data and validation.